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POLYFER
Multifunctional setup of laser microprocessing POLYFER uses technology of acoustic-ablation laser treatment of materials. The setup is designed for precise laser cutting, dicing, engraving, contouring microstructures, perforation microholes and slits, trepanning arbitrary shaped bores in metals, alloys, dielectrics and semiconductors. The POLYFER setup also may be used for precise laser welding of metals.

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Contact us
Tel/Fax:+7(812)251-6992
Tel:+7(812)251-7333
+7(812)251-0304
198103, Rizhskiy pr. 26,
St.-Petersburg, Russia

e-mail: info@laser-design.com
contact@laser-design.com
aalexeev@mail.admiral.ru

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Andrey Nevzhinskiy
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